By John H. Lau
One-stop, state-of-the-art consultant to turn chip applied sciences. you can now flip to a unmarried, all-encompassing reference for a pragmatic knowing of the fast-developing box that is taking the electronics via hurricane. reasonably cheap turn Chip applied sciences, by way of John H. Lau, brings you on top of things at the financial, layout, fabrics, process,equipment, caliber, production, and reliability concerns concerning low in cost turn chip applied sciences. This eye-opening assessment tells you what you must find out about utilizing turn chip applied sciences to direct chip attach(DCA), turn chip on board (FCOB), wafer point chip scale package deal (WLCSP), and plastic ball grid array (PBGA) package deal assemblies. you will discover turn chip problem-solving equipment, and find out how to pick out an economical layout and trustworthy, high-yield production approach in your interconnect structures as you explore...
*IC developments and packaging know-how updates *Over 12 varied wafer-bumping methods...more than a hundred lead-free solder alloys *Sequential increase PCB with microvias and via-in-pad *How to choose underfill fabrics *And a lot, even more!